Cyntec Launches Comprehensive Total Solution for AI Servers and Switches, Empowering Efficient Computing with High-Power-Density Chokes

Amid the rapid advancement of AI technology, data centers are imposing increasingly stringent requirements on the power density and thermal efficiency of AI servers. As a global leader in power and passive components, Cyntec has keenly grasped industry needs and proudly launched a comprehensive total solution tailored for AI servers and switches. Simultaneously, leveraging core products such as high-power-density, high-efficiency power chokes, the company is injecting robust momentum into next-generation AI infrastructure and High Voltage Direct Current (HVDC)-powered data centers.

Cyntec's total solution for AI servers and switches fully covers the end-to-end needs from power supply architectures to core components. Focusing on HVDC power architectures, the solution encompasses a series of advanced products, including high-power-density chokes, power modules, busbars, and e-Fuses. It seamlessly adapts to full-scenario applications, from existing AC-DC conversion and 400V/800V busbar distribution to 0.xV core power supply for terminal servers. Whether catering to the current mainstream 50V and 12V power supply systems or the future 800V architecture designed for higher power demands, the solution delivers stable and reliable support, enabling customers to meet strict requirements in performance, safety, thermal management, and beyond.

Among these offerings, the high-power-density, high-efficiency power chokes stand out as the core highlight, demonstrating Cyntec's technological prowess. Specifically engineered for critical devices such as AI server SXM accelerator cards, UBB motherboards, and switches, these chokes are the culmination of Cyntec's expertise in material formula research, product characteristic simulation, and advanced automated production. By utilizing 3D modeling to optimize coil parameters and adopting exclusive patented material formulas, the products achieve significantly enhanced saturation current and drastically reduced power loss, delivering exceptional performance within a compact form factor.

The innovative TLVR power inductor, featuring a multi-phase, thin-profile design, not only improves dynamic response efficiency and power conversion efficiency but also effectively reduces power design space and energy consumption. It successfully meets the rigorous high-current transient requirements of AI server applications. Furthermore, the integration of integrated choke design and the development of high-permeability materials have further strengthened the product's high-power-density advantages, with the multi-coil integration concept achieving a qualitative leap in space utilization. In terms of transient response, the series of inductors have optimized design to increase the magnetic leakage coefficient to 0.97, significantly reducing loop inductance and thinning the thickness from 11mm to 3mm, demonstrating industry-leading technical standards.

Beyond the core choke products, other key components in the total solution are equally impressive. The highly integrated power modules adopt proprietary IC packaging and advanced magnetic technology, achieving miniaturization, significantly improving current density and transient response capabilities to fully match the growing computing power demands of GPU/xPU/ASICs systems. The liquid-cooled busbars support a maximum power capacity of 50Vdc/8000A, delivering excellent heat exchange performance through optimized fin channels and flow rate design to ensure the stable operation of AI data centers. The innovative e-Fuse module can be integrated into rack-mounted PDU/CBU/BBU and DC power supplies within HVDC architectures, providing protection against overvoltage, overcurrent, and overheating, while supporting safe disconnection and soft start during hot-swapping. With a response speed over a thousand times faster than traditional products, it offers substantially enhanced safety.

Adhering to innovation and quality as its core values, Cyntec, a global leader in power choke and power module solutions, deeply integrates innovative materials with power design technology. It not only provides a one-stop, high-performance total solution for AI servers and switches but also plays a pivotal role in driving energy efficiency and sustainability in AI and High-Performance Computing (HPC) data centers, safeguarding the rapid development of the global AI industry.